POLY Division: - Call for Papers - Polymer Materials and Processing for MEMs Technology Upcoming American Chemical Society (ACS) Symposium 2003 Fall National ACS Meeting New York, New York, USA September 7-12, 2003 OVERVIEW: The material of choice for microelectrical mechanical systems (MEMs) has long been silicon, and the microfabrication techniques have been borrowed from the microelectronics industry. However, many exciting MEMs applications are requiring a far more diverse set of materials and processing, and MEMs R&D has now tapped into the wealth of materials and processing available in the polymer industry. Polymers are being incorporated into a wide variety of MEMs devices to provide improved material properties, biocompatibility, flexibility, transparency, larger surface area, selected electrical properties, ease of processing, and lower cost to produce. In addition to their traditional uses in microfabrication as photoresists, adhesives, and packaging, polymers can now be found in MEMs technology as structural components, membrane actuators, microlens, microfluidic valves and substrates, high surface area sensors and preconcentrators, microfilters, conductive composites, and complex 3-D microstructures. TOPICS OF INTEREST: The symposium will focus on polymer materials and processing that are enabling for microfabrication and functioning of a MEMs device including the following areas: Polymeric microfluidic components (e.g. substrates, valves, pump, membranes) Refractive microptical components (e.g. microlens, soft lens, waveguides, beam splitters) High performance polymers for microsensors, preconcentrators, or molecular filters Flexible MEMs using polymeric materials High aspect ratio or complex 3-D polymeric structural components for MEMs Specialty polymers and polymeric coatings for biocompatible MEMs Polymers and processing for soft lithography and advanced lithographic techniques Polymeric precursors for ceramics and non-Si structures in MEMs devices Polymer processing for MEMs including: a. Surface and bulk micromaching of polymers b. Soft lithography, photopolymerization, and micro stereolithography c. Micro injection molding or microcasting d. Polymer bonding and other multi-layer processing techniques ABSTRACT AND PRE-PRINT SUBMISSION: Both an abstract (about 150 words) and a pre- print (1-2 pages with figures and graphics) are required by MAY 2, 2003. Both oral and poster presentations are being solicited. To participate in this symposium, please submit an abstract via the ACS online abstract submission system OASys at http://oasys.acs.org/acs/226 nm/poly/papers/index.cgi or contact the symposium organizer below. The electronic preprint should be prepared as a word processing document using the POLY2002 Preprint Template available on the division's home page (http://www.chem.umr.edu/~pol y/preprints.online.html). The preprint is also submitted through OASys using the record number issued to the paper at the time of the abstract submission. The submitted preprint will be automatically converted into PDF format and made viewable by the authors. Until the preprint submission close date (May 2, 2003), the authors may re-transmit as many revised drafts as necessary until the PDF document conforms to the required preprint format. After preprint submission close date, the PDF file will be reviewed online by the Symposium organizer. Upon approval by the organizer, the preprint file will be forwarded to the preprint editors for final acceptance. SYMPOSIUM ORGANIZER: FURTHER INFORMATION: Craig C. Henderson http://www.polyacs.org Sandia National Laboratories Livermore, CA 94550 cchende@sandia.gov 925-294-3628 (FAX: 294-3870) ********************************************************************************** ******************************